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268 pages

Ten Essential Skills for Electrical Engineers

Creator: Barry L. Dorr | Technology & Engineering - 2014-01-21

This book is a ‘must have’ on the bookshelf of any newly practicing hardware engineer and those who mentor them.” —Roger Colbath, Engineering Director, ViaSat, Inc.

Publisher: John Wiley & Sons

About this book
The book is a review of essential skills that an entry-level or experienced engineer must be able to demonstrate on a job interview and perform when hired. It will help engineers prepare for interviews by demonstrating application of basic principles to practical problems. Hiring managers will find the book useful because it defines a common ground between the student's academic background and the company's product or technology-specific needs, thereby allowing managers to minimize their risk when making hiring decisions. Ten Essential Skills contains a series of "How to" chapters. Each chapter realizes a goal, such as designing an active filter or designing a discrete servo. The primary value of these chapters, however, is that they apply engineering fundamentals to practical problems. The book is a handy reference for engineers in their first years on the job. Enables recent graduates in engineering to succeed in challenging technical interviews Written in an intuitive, easy-to-follow style for the benefit of busy students and employers Book focuses on the intersection between company-specific knowledge and engineering fundamentals Companion website includes interview practice problems and advanced material


EDN, Electrical Design News

Electrical engineering - 1990

Total Integration assures smooth, error-free data transfer throughout the system with functionally organized menus to speed you through your design jobs. NO Limitation means that EE Designer can handle SMT, ground planes with heat- relief ...



366 pages

Electrical Modeling and Design for 3D System Integration, 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Creator: Er-Ping Li | Science - 2012-04-10

The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.

Publisher: John Wiley & Sons

About this book
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systemsBased on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures.Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through:The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systemsThe semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple viasTwo- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrationsThe physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boardsAn equivalent circuit model of through-silicon viasMetal-oxide-semiconductor capacitance effects of through-silicon viasEngineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.


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